Acacia’s engineering and management teams have extensive experience in optical systems and networking, digital signal processing, large-scale ASIC design and verification, silicon photonic integration, system software development, hardware design and high-speed electronics design. This broad expertise in a range of advanced technologies, methodologies and processes enhances our innovation, design and development capabilities and has enabled Acacia to develop and introduce multiple modules, DSP ASICs and silicon PICs since its founding.
We continue to innovate and extend our technology leadership
Our coherent DSP ASICs and silicon PICs are at the heart of our products’ abilities to deliver cost-efficient high performance. We intend to continue to invest in our technology to deliver innovative and high-performance products and to identify and solve challenging interconnect needs.
Acacia believed that a new kind of company and design approach was needed to meet this challenge where advanced Digital Signal Processing, Application Specific Integrated Circuits, Silicon Photonics, transceiver subsystem hardware and software design and development experts all work together on a single objective—to build the best 100G and above coherent technology and products in the market.
For customers, this translates into highly optimized coherent products that are brought to market in close collaboration with customer’s needs. As more advances in optical and digital circuitry evolve, Acacia is well positioned to leverage those advances by utilizing our integrated product development model that has produced high-speed coherent optical interconnect products that are transforming communications networks in the long haul, subsea and Metro markets.