Coherent Interconnect Module 8
Maximize network coverage with the industry's first single carrier 1.2T pluggable
1.2 Tbps capacity over a single wavelength within a 150GHz channel
Powered by 8th generation 5 nm CMOS Jannu DSP ASIC
Supports Cloud/DCI, metro, long-haul and submarine with wide network coverage for 800G
Transmission Flexibility
to optimize fiber utilization, simplify deployment, and reduce CAPEX and OPEX
Maximize
transmission data rate across wide range of multi-haul network applications
Double Transmission Capacity
over even greater reaches
Get more than 65% Power-per-bit Savings
CIM 8 Technology Differentiators
Second Generation 3D-Shaping
The CIM 8 powered by the Jannu DSP utilizes Second Generation 3D Shaping technology optimizes capacity and reach for network operators up to 1.2T and 140Gbaud with 20% higher spectral efficiency over the previous generation. 2nd Generation 3D Shaping provides state-of-the-art transmission shaping capabilities using enhanced probability constellation shaping (PCS) algorithms to provide continuous modulation, baud rate, and spectral efficiency adjustment.
Adaptive Baud Rate
A feature first introduced in Acacia’s Pico DSP and AC1200 module, Adaptive Baud Rate has been widely embraced by network operators. The CIM 8 Adaptive Baud Rate feature provides customers with continuous baud rate adjustment up to 140Gbaud to optimize utilization of available spectrum in a single-span or in cascaded ROADM paths. With this continuous baud rate tuning capability, the CIM8 also offers maximum capacity over any channel plan.
Other Key Features
The CIM 8 powered by Jannu includes Acacia’s advanced line-rate power-efficient processing algorithms to efficiently overcome fiber transmission impairments over greenfield or brownfield fiber infrastructures by compensating linear and non-linear impairments, as well as providing state-of-polarization (SOP) tracking twice as fast as the previous generation. In addition, the CIM 8 powered by Jannu leverages Acacia’s new innovative soft-decision error correction (SD-FEC) to further enhance performance.
High-Performance DSP ASIC
with low power dissipation that the industry has come to expect from Acacia products, while utilizing algorithms for advanced transmission capabilities for the highest level of performanceand impairment mitigation
3D Siliconization
3D Siliconization, which applies advanced integration techniques to enable a volume manufacturable coherent device that includes all the high speed opto-electronic functions, resulting in high signal integrity and performance via the reduction of electrical inter-connects.
