Coherent Interconnect Module 8

The Coherent Interconnect Module 8 (CIM 8) is the industry’s first 1.2T faceplate pluggable coherent solution. Powered by Jannu, our 8th-generation digital signal processor (DSP) ASIC, the CIM 8 is designed to deliver industry-leading performance with single carrier 1.2T operation. It combines the 5nm CMOS Jannu DSP with our 3D Siliconization packaging technology which includes the silicon photonics integrated circuit (SiPh PIC), high-speed modulator driver and transimpedance amplifier (TIA) in a single opto-electronic package.

The CIM 8 powered by Jannu is a 140Gbaud solution designed to:

Offer network operators the ability to maximize transmission data rate across a wide range of multi-haul network applications including DCI, metro, long-haul and subsea.
Enable network operators to double their transmission capacity over even greater reaches. For links requiring maximum capacity such as high-capacity DCI links, the new module can provide 1.2T capacity over a single wavelength within a 150GHz channel.

Acacia CIM 8

The Jannu DSP features Acacia’s second-generation 3D Shaping technology which gives service providers unprecedented transmission flexibility to match their network’s architecture, optimize fiber utilization, simplify deployment, and save on both CAPEX and OPEX. The second-generation 3D Shaping technology leverages our enhanced probabilistic constellation shaping (PCS) algorithms and Adaptive Baud Rate, a feature introduced in Acacia’s Pico DSP and widely embraced by network operators. The Adaptive Baud Rate feature in Jannu provides customers with continuous baud rate adjustment up to 140Gbaud to optimize utilization of available spectrum in a single-span or in cascaded ROADM paths. With this continuous baud rate tuning capability, the CIM 8 also offers maximum capacity over any channel plan.

The Jannu DSP includes Acacia’s advanced line-rate power-efficient processing algorithms to efficiently overcome fiber transmission impairments over greenfield or brownfield fiber infrastructures by compensating linear and non-linear impairments, as well as providing state-of-polarization (SOP) tracking with industry leading response times. In addition, the Jannu DSP leverages Acacia’s new innovative soft-decision error correction (SD-FEC) to further enhance performance.

CIM 8 leverages Acacia’s 3D Siliconization technology, a major contributing factor in how the module can cross the terabit capacity threshold and support faceplate pluggable optics, simplifying network deployment and maintenance.

3D Siliconization utilizes highly scalable and reliable volume electronics manufacturing processes which applies integration and 3D stacking packaging techniques to enable a single device to include all the high speed opto-electronic functions necessary for coherent transceivers. This device decreases footprint by including the DSP, PIC, drivers, and TIAs, and is manufactured using standard CMOS packaging processes that leverage the same reliability, cost, and volume scaling advantages.

With 3D Siliconization, the high-speed RF interfaces are tightly coupled together, resulting in improved signal integrity for high baud rate signals. The high-density packaging as well as an advanced high-speed modulator provides the CIM 8 with superior frequency response that enables its 140Gbaud performance.

The CIM 8 continues Acacia’s history of technology leadership by providing industry leading performance based on the same silicon photonics used in high volume pluggable modules.