It comes as no surprise that one of the hottest topics from the past 3 years is still a hot topic at #OFC22.

This paper describes how silicon photonic (SiPh) opto-electronic integration and packaging, with its improved RF performance, is designed to enable next-generation coherent transmission beyond 100Gbaud and provide network operators with the ability to avoid “half-step” capacity upgrades and allow them the full step upgrades they need without sacrificing reach or stranding network bandwidth when migrating from current-generation solutions.