Technology Expertise Drives Innovation


Silicon photonic integration allows tighter monolithic integration of many optical functions within a single device, greatly reducing size and power.


RF layout and simulation predict how high-frequency electrical signals propagate and interact to optimize performance.


Subsystem integration combines subsystem or sub-components into one all-encompassing system that seamlessly function together.


Advanced, power efficient algorithms enable the best performance for each application. A comprehensive design and verification process assures quality.


Opto-electronic integration and co-packaging reduce components in size and power while also increasing functionality and performance.

Five In-house Technology Capabilities Deliver Multiple Advantages

Acacia has the unique capabilities in-house for building superior optical interconnects. This comprehensive technology portfolio improves efficiencies between layers and enables a high level of multi-disciplinary collaboration across all stages of the product development lifecycle. Working together, the five key technology capabilities deliver faster time to market, superior performance, rapid innovation, and optimal ROI.

Faster Time to Market

Superior Performance

Rapid Innovation

Optimal ROI

DSP ASIC Expertise Drives Flexibility and Performance

Our Digital Signal Processor (DSP) Application-Specific Integrated Circuits (ASICs) are at the heart of our module products. They enable the optical performance and low power that have become synonymous with Acacia throughout the optical industry. Leveraging internally developed advanced signal processing algorithms, Acacia can introduce low power complementary metal-oxide semiconductor (CMOS) integrated circuits that offer both flexibility and performance.

Silicon Photonic Integrated Circuits (PICs)

Acacia is widely recognized as a pioneer of silicon-based PICs for coherent optical communications—the highly integrated Silicon Photonics single-chip PICs are low power and ultra-compact. Coupled with Acacia’s DSP ASIC, the combination offers low power and very compact size with exceptional performance.

Leveraging mature CMOS processes, Acacia’s PIC is optimized for high reliability and high yield, enabling scalable high volume manufacturing.

Optimizing Integration Leveraging Silicon for Performance Across Acacia’s Broad Portfolio of Products

Acacia uses silicon as the platform for the integration of multiple discrete photonic functions and offers greater levels of integration while reducing the density and cost of optical interconnect products. Leveraging the advances in silicon processing, each new generation of product has enabled higher data transmission rates, lower power and higher performance than the one before it.

3D Siliconization Technology— An Acacia Innovation

This integration and packaging approach utilizes highly scalable and reliable volume electronics manufacturing processes that apply integration and 3D stacking packaging techniques to enable a single device to include all the high speed opto-electronic functions necessary for coherent transceivers.

3D Siliconization not only decreases footprint by including into a single device the DSP, PIC, drivers, and TIAs, but it also results in improved signal integrity and performance because the high-speed RF interfaces are tightly coupled together, resulting in the reduction of electrical interconnects. The device is manufactured using standard CMOS packaging processes that leverage the same reliability, cost, and volume scaling advantages.