Broad Portfolio of Coherent Products for a Wide Range of Network Applications
Coherent Interconnect Module 8
Industry’s first single carrier
1.2T pluggable
AC1200 Product Family
Widely deployed 1.2T
transponders
CFP2 Product Family
Industry’s first 100G/200G and
now 400G solutions
Coherent Optical Components Powering 100G to 1.2T Coherent Modules
Our module products are powered by our internally developed and purpose-built coherent Digital Signal Processor (DSP) Application-Specific Integrated Circuits (ASICs) and silicon Photonic Integrated Circuits (PICs), which are engineered to work together and integrate numerous signal processing and optical functions to deliver complete, cost-effective high-speed solutions. These integrated solutions leveraging Acacia’s technology differentiators offer numerous benefits.
•Reduced power
•Reduced size
•Increased capacity
DSP ASICs
Our DSPs are at the heart of our module products. They enable the optical performance and low power that have become synonymous with Acacia throughout the optical transport industry. With multiple generations ahead of the competition, Acacia’s coherent DSPs for subsea capable performance as well as interoperable MSA pluggable module applications are designed to fulfill the needs of our customers.
Silicon PICs
Acacia is widely recognized as a pioneer of silicon-based PICs for coherent optical communications—the highly integrated Silicon Photonics single-chip PICs are low power and ultra-compact. Coupled with Acacia’s DSP, the combination offers low power and very compact size with exceptional performance. Acacia’s PIC is optimized for high reliability and high yield, enabling scalable high volume manufacturing.
Disruptive Innovation
Acacia has harnessed the power of digital signal processing and silicon photonics and introduced packaging innovations such as 3D Siliconization. This has enabled us to take bulky and complex technology and accelerate its evolution into more compact, easier-to-use, and easier-to-manufacture solutions. These solutions encompass advancements in many different areas of technology such as integrated silicon design and packaging, DSP algorithms and technology, and high-speed RF design.
Transform Cloud and Communication Networks
Cloud/Data Center Interconnect
Cloud providers, content providers, and other network operators need to connect data centers.
Metro Carrier
Interconnecting a wide range of traffic from central offices and data centers within a metropolitan area
Long Haul
Linking major population centers within continents, spanning distances from one thousand to a few thousands of kilometers
Submarine
Optical interconnections spanning thousands of kilometers under the world’s oceans.
Wired Access
On-ramps to the internet, where connections from many individual residential or enterprise customers are aggregated.
