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Acacia – all the pieces
to the interconnect puzzle

dsp
dsp-content
rf
rf-content
sw
sw-content
optics
optics-content
HIGHER YIELD

HIGHER YIELD

SUPERIOR PERFORMANCE

SUPERIOR PERFORMANCE

RAPID INNOVATION

RAPID INNOVATION

BETTER INTEGRATION

BETTER INTEGRATION

LOWER COST

LOWER COST

3D Siliconization applies integration and 3D stacking techniques to enable a single packaged device that includes all the high speed opto-electronic functions necessary for coherent communications. This device, which includes the DSP, Silicon Photonic Integrated Circuit, RF drivers and TIAs, is manufactured using standard electronics packaging processes. 3D Siliconization also improves signal integrity and performance via the reduction of electrical inter-connects, in addition to the benefits in cost, reliability, power, and size.

Link to Competitive

Our Competitive Strengths

Industry Awards & Accolades

massecon-impact-award-2011
inc-500-2014
massecon-impact-award-2016
50-on-fire-2016-finalist
masstlc-leadership-awards-finalist-2016
fierce-innocation-awards-2016-telecon-winner
technology-fast-500-2017-north-america-award
ernst-young-entrepreneur-of-the-year-2017-winner
2017-lightwave-innocation-reviews
2018-outstanding-components-vendor
bostinno-coolest-companies-finalist-badge
ngon-award
2019-leading-lights-award-220x200
2019-5-0-lw-innovation-review
2020-outstanding-components-vendor
acacia-ecoc2020-industry-awards-logo
2022-lightwave-award-2
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