Frequently Asked Questions
General
Key Technology and Products
3D Siliconization not only decreases footprint by including into a single device the DSP, PIC, drivers, and TIAs, but it also results in improved signal integrity and performance because the high-speed RF interfaces are tightly coupled together, resulting in the reduction of electrical interconnects. This is critical for high baud rate operation. The device is manufactured using standard CMOS packaging processes that leverage the same reliability, cost, and volume scaling advantages.
Acacia was a pioneer of silicon photonics in 2012 when it was the first coherent module vendor to envision silicon as the platform for the integration of multiple discreet photonic functions while increasing the density and reducing cost of optical interconnect products.
Acacia’s portfolio of QSFP-DD modules includes 400G, 400ZR, 400ZR+, 400G OpenZR+, 400G ULH, 800ZR, and 800G ZR+ modules. These products support DCI edge, metro/regional, long haul and ultra long haul networks, submarine, as well as service provider access network applications.
Customers and Market
Acacia’s coherent modules are already being deployed in today’s AI build outs and customers are projecting increasing bandwidth requirements in the future which will be addressed with next-generation modules such as 800ZR/ZR+ and 1.6T MSA pluggables. In addition, its expanded line of client optics components deliver the higher-bandwidth, lower power and smaller footprint required for even the most demanding AI workloads.
