By Acacia | Posted on January 26, 2023
Today, Acacia, now part of Cisco, announced that it began shipping the Coherent Interconnect Module 8 (CIM 8) to customers at the end of 2022. These modules in customer system line cards are currently in Tier 1 carrier network field trials.
Supporting data rates up to 1.2 terabits per second (1.2Tbps), the CIM 8 is the first commercial single optical carrier coherent transceiver that breaks into the “Terabit Era.” It is powered by Jannu, Acacia’s 8th generation digital signal processor (DSP) ASIC, which is based on 5nm CMOS and features the latest in Silicon Photonic technology. This solution delivers industry-leading performance in a small faceplate pluggable module by combining the Jannu DSP with 3D Siliconization packaging technology. The CIM 8 supports multi-haul applications by using second-generation 3D Shaping technology and continuous baud rate adjustment up to 140Gbaud, enabling customers to scale their networks efficiently and cost-effectively.
“The ability to maximize transmission data rate across a wide range of multi-haul network applications is key for cost-effectively scaling networks,” said Bill Gartner, SVP / GM Optical Systems and Optics Group at Cisco. “Not only does the CIM 8 deliver exceptional performance, but it also consumes less than half the power per bit of competing solutions, allowing us to support terabit transmission with a small pluggable module.”
“Shipping CIM 8 Terabit Era optical transceivers with 140Gbaud capability to customers and seeing them tested in carrier networks is very exciting,” said Mehrdad Givehchi, VP of Engineering for Acacia. “Delivering the highest channel capacity and longest reach with maximum fiber utilization, the CIM 8 transceiver enables a wide range of multi-haul network applications including DCI, metro, long-haul, and subsea.”
Benefits of Increased Baud Rates
Increasing baud rate is an efficient way to enable more cost-effective optical networks by reducing the number of optics needed to support a given transmission capacity. By doubling the baud rate between successive generations, CIM 8 supports twice the capacity per carrier over greater reaches than earlier generations such as our widely deployed AC1200 coherent module. Three 400GbE client interfaces can be transmitted over virtually any network application, delivering 1.2Tbps per carrier capacity for high-capacity DCI interfaces, 800G per carrier capacity over most optical links using 4 bits/symbol (~16QAM) modulation and 400G QPSK over ultra-long-haul and subsea distances.
Performance Optimizing Features Enabled by the Jannu DSP
A key feature of the Jannu DSP is Acacia’s second-generation 3D Shaping technology, which includes advanced Probabilistic Constellation Shaping, Adaptive Baud Rate, and enhanced transmission impairment compensation algorithms providing superior performance using a single carrier implementation. This technology gives service providers unprecedented transmission flexibility to match their network’s architecture, optimize fiber utilization, simplify deployment, and save on both CAPEX and OPEX.
The Jannu DSP provides customers with continuous baud rate adjustment up to 140Gbaud and continuous modulation to optimize utilization of available spectrum in point-to-point DWDM or cascaded ROADM paths. As a single carrier design, the Jannu DSP incorporates Acacia’s most advanced line-rate processing algorithms to efficiently overcome fiber transmission impairments across various fiber types and fiber cable installation conditions. These power-efficient algorithms are designed to compensate fiber non-linearity to achieve longer transmission distance, automatically compensate for very large chromatic dispersion over trans-Pacific submarine cables, tolerate older deployed fibers with high Polarization Mode Dispersion, as well as provide fast state-of-polarization tracking required for aerial fiber cables in stormy weather conditions.
Leverages Acacia’s 3D Siliconization
The CIM 8 continues Acacia’s history of technology leadership by delivering industry leading performance based on the same silicon photonics used in high-volume pluggable modules. 3D Siliconization, a key enabler for the industry leading 140Gbaud, uses highly scalable and reliable volume semiconductor manufacturing processes, leveraging 3D stacking technology to enable a single packaged device to include all the high speed electrical and opto-electronic functions necessary for coherent transceivers. This device decreases footprint by integrating the DSP, Photonic Integrated Circuit, modulator drivers, and Transimpedance Amplifiers, and is manufactured using standard CMOS packaging processes that offer improvements in reliability, cost, and volume scaling.